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authorRonald Hoogenboom <hoogenboom30@zonnet.nl>2008-01-19 00:04:46 +0000
committerCarl-Daniel Hailfinger <c-d.hailfinger.devel.2006@gmx.net>2008-01-19 00:04:46 +0000
commit7ff530b40ef862e4d1bf6b30c34635a279a1b312 (patch)
tree2f1bd36d392569740f39ed531de721c2eb54661c /flash.h
parent42eb17fc5ed4feb8f6b2f8f2b20626d539861afd (diff)
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Further abstract SPI functions to allow chips bigger than 512 kB behind IT8716Fs
Support SPI flash chips bigger than 512 kByte sitting behind IT8716F Super I/O performing LPC-to-SPI flash translation. Corresponding to flashrom svn r181 and coreboot v2 svn r3061. Signed-off-by: Ronald Hoogenboom <hoogenboom30@zonnet.nl> Signed-off-by: Carl-Daniel Hailfinger <c-d.hailfinger.devel.2006@gmx.net> Acked-by: Carl-Daniel Hailfinger <c-d.hailfinger.devel.2006@gmx.net>
Diffstat (limited to 'flash.h')
-rw-r--r--flash.h10
1 files changed, 10 insertions, 0 deletions
diff --git a/flash.h b/flash.h
index dffb1b80..048f7440 100644
--- a/flash.h
+++ b/flash.h
@@ -234,7 +234,16 @@ extern struct flashchip flashchips[];
#define TI_ID 0x97 /* Texas Instruments */
+/*
+ * W25X chips are SPI, first byte of device ID is memory type, second
+ * byte of device ID is related to log(bitsize).
+ */
#define WINBOND_ID 0xDA /* Winbond */
+#define WINBOND_NEX_ID 0xEF /* Winbond (ex Nexcom) serial flash devices */
+#define W_25X10 0x3011
+#define W_25X20 0x3012
+#define W_25X40 0x3013
+#define W_25X80 0x3014
#define W_29C011 0xC1
#define W_29C020C 0x45
#define W_29C040P 0x46
@@ -297,6 +306,7 @@ void generic_spi_write_enable();
void generic_spi_write_disable();
int generic_spi_chip_erase_c7(struct flashchip *flash);
int generic_spi_chip_write(struct flashchip *flash, uint8_t *buf);
+int generic_spi_chip_read(struct flashchip *flash, uint8_t *buf);
/* 82802ab.c */
int probe_82802ab(struct flashchip *flash);